Produse pentru tratare (3)

HPM® X-750 is a precipitation –hardenable nickelchromium alloy which is well suited for a wide range of corrosive and oxidizing environments where strength must be maintained to elevated temperatures. The alloy composition provides a product which performs well at elevated temperatures up to 1300° Farenheit. The strength can be increased by heat treatment. The alloy is readily formable in the annealed temper and can be joined by the standard welding and brazing processes. Available Sizes: HPM® X-750 is available from Hamilton Precision Metals as strip product in thicknesses from 0.001” to 0.025” (0.0254 mm to 0.635 mm) in widths up to 12.0” (304.8 mm). The material conforms to AMS 5542, AMS 5598 and UNS N07750. Density:0.298 lbs/cu.in. Melting Point (Approx.):1400°C Electrical Resistivity @ R.T.:121 Microhm·cm Temperature Coefficient of Resistivity (20° to 95°C):12.6 x 10–6/°C Thermal Conductivity @ R.T:12.0 W/m·K Magnetic Attraction:None

Beryllium Copper 25 is a Copper base alloy with the capability of being strengthened by precipitation heat treatment. The alloy furnishes the best combination of electrical conductivity, corrosion resistance and mechanical strength necessary for numerous electronic and electromechanical devices. The alloy is quite satisfactory for fabrication with good formability and joining characteristics. Forming is readily accomplished from the annealed temper. Severe bending will be less successful from hard or heat treated tempers and requires large fold radius ratios. Beryllium Copper 25 is able to be soldered, brazed, and welded by most standard techniques. The brazing temperature must be kept under 1450º F and cycle time minimized to avoid loss of heat treated strength. Heat treating should be performed subsequent to welding to obtain uniform high strength. The alloy is not susceptible to an increase in magnetic attraction from plastic deformation during service Density:0.298 lbs./cu.in. Melting Point (Approx.):865°C Electrical Resistivity @ R.T.:7.81Microhm·cm Thermal Expansion Coefficient (20° to 200°C):17.5 x 10-6/°C Thermal Conductivity @ R.T.:105 W/m·K Magnetic Attraction:None

HPM® Beryllium Nickel is a Beryllium-Nickel alloy capable of high strength through precipitation heat treatment. The excellent spring characteristics to 550°F make it suitable for many of the most demanding electromechanical devices. The alloy can be readily formed and even deep drawn from the annealed temper. Cold rolled tempers prior to heat treatment can be blanked and folded provided a radius to thickness ratio approaches 2.0. The optimum heat treatment for highest strength is 925ºF for 2 hours. The material can be joined using conventional TIG methods, silver brazed and soldered. Available Sizes: HPM® Beryllium Nickel is available from Hamilton Precision Metals as strip product in thicknesses from 0.0005” to 0.025” in (0.0127 to 0.635 mm) widths up to 7.0” (177.8 mm). A foil product is available as thin as 0.000085” (0.002159 mm) and widths of 4.0” (101.6 mm) maximum. The material conforms to UNS N03360. Density:0.309 lbs/cu.in. Melting Point (Approx.):1185°C Thermal Expansion Coefficient (25° to 550°C):14.4 X 10-6/°C Thermal Conductivity @ R.T:48.4 W/m·K