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ALD (Atomic Layer Deposition) is a deposition process that allows for the vacuum deposition of thin films of material using gaseous precursors. The parts to be treated are placed in a vacuum machine. After introducing precursor A, which deposits on the entire surface of the parts, precursor B is introduced and reacts with the initially deposited atoms to form the first atomic layer. This cycle is repeated until the desired thickness is achieved. The deposition temperature ranges from 150 to 200°. Advantages Perfect conformability Excellent homogeneity on 3D parts Reproducibility of the coating Control of thickness at the nanometer scale Good chemical stability Excellent barrier layer Non-polluting technology

PVD (Physical Vapor Deposition) is a coating process that allows for the deposition of thin films of material in a vacuum using vapor. The parts to be treated are placed in a vacuum machine. After introducing a gas, a plasma is created, and positively charged ions are accelerated by an electric field onto the negatively charged electrode or "target." The target is the material to be deposited. The ions strike the target with enough force to eject atoms. These atoms condense on nearby surfaces, forming the coating. To increase processing speed, the targets are mounted on a magnetron, thereby enhancing the efficiency of the process and making it industrial. This low-temperature process allows for the coating of all types of materials on a wide range of substrates. It enables the deposition of a large variety of materials.