Produse pentru testează (4)

Testare și Inspecție

Testare și Inspecție

Testing services from a specialist: we are specialized as a testing laboratory for the simulation of specific environmental conditions and the monitoring of the influences of these conditions on electronic assemblies. We offer the following services in our test lab and at your site as contract testing.
Ceai: Setul de test, acum nou

Ceai: Setul de test, acum nou

Jetzt ist es endlich soweit ✓ Lange habt ihr uns auf Social Media danach gefragt, ob wir euch einen Testset von unseren Teevariationen anbieten können. Die Zeit ist gekommen. Hier ist das Tropical Tea Tester Set! Bestehend aus 15 verschiedenen Testgrößen unserer beliebtesten Teemischungen. Das Beste daran ist, Du bekommst das komplette Teeset für nur 34,99 € anstatt für 49,99 € ! Jetzt bestellen, solange der Vorrat reicht
Test de șoc termic și test de șoc termic

Test de șoc termic și test de șoc termic

We are specialized in performing thermal shock testing of electronic and mechanical assemblies and have a lot of experience with the requirements of the automotive industry and medical technology. On behalf of our customers, we perform environmental and climatic tests according to customer specifications and applicable standards, thus uncovering optimization potential. We will be happy to advise you with regard to your testing tasks and, together with you, transfer the entire testing process into a specification sheet. OUR OPPORTUNITIES 2-chamber system air-air Test chamber volume up to 130 liters Temperature range hot chamber 50°C to 200°C Temperature range cold chamber -80°C to -100°C Change between chambers <15 seconds Maximum test material weight 25 kg State monitoring of the test specimens during the test
Dispozitive Integrate Mecatronice (Mid)

Dispozitive Integrate Mecatronice (Mid)

Mechatronic integrated devices or molded interconnect devices (injection-molded circuit carriers) are spatial electronic assemblies – so-called 3D-MID. A special process is used to apply metallic conductor tracks to a specific substrate material (often plastic), thus creating three-dimensional assemblies that also serve as circuit carriers. These spatial electronic assemblies are manufactured using 3D-MID technology and, compared to conventional assemblies, enable the integration of electronic, mechanical, fluidic, optical and thermal functions. The resulting additional benefits represent advantages that cannot be realized with two-dimensional circuit carriers (printed circuit boards).