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The robust BGA package and extended temperature range make these modules the ideal choice for high-volume industrial applications and mobile data services. A subset of the interfaces are pin-to-pin compatible with its predecessor, allowing easy upgrade. FAMILY CONCEPT The xE864 family features a common 30x30 mm footprint, low profile BGA package. This allows developers and integrators to easily drop in different variants of the xE864 family with little design and integration time and effort. KEY FEATURES Easy migration from previous Telit versions and short time-to-market BGA package enables the design of compact applications, with reduced cost compared to board-to-board connector mounting Easy firmware update by transmitting only a small delta file

This Product is arriving to the End of Life status. It is not recommended for new designs. Last time buy June 10th 2016. The Quad-band 850/900/1800/1900 MHZ GSM/GPRS GC864-QUAD V2 is designed for industrial applications requiring a compact footprint and board-to-board connector. The xC8ó4 family provides pin-to-pin Compatibility with its UMTS / CDMA counterpart products. This module allows a SIM holder to be mounted on the bottom side of its PCB. This option reduces the integration effort. Key Benefits Design once and deploy globally thanks to the xC864 unified form factor Premium FOTA Management - Easy firmware update by transmitting only a small delta file PYTHON Script Interpreter - customers can run their Python applications directly inside the module RUN AT Remote command and event monitoring services SIM Access Profile